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Modeling and simulation of integrated capacitors for high frequency chip power decoupling
Kroeger, F., Krusius, J.P., Diaz-Alvarez, E.Volume:
23
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/6144.888843
Date:
January, 2000
File:
PDF, 334 KB
english, 2000