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Microstructure based statistical model of electromigration damage in confined line metallizations in the presence of thermally induced stresses
Korhonen, M. A., Bo̸rgesen, P., Brown, D. D., Li, Che-YuVolume:
74
Year:
1993
Language:
english
Journal:
Journal of Applied Physics
DOI:
10.1063/1.354305
File:
PDF, 1.52 MB
english, 1993