Reliability and Failure Analysis of Lead-Free Solder Joints...

IEEE Transactions on Components and Packaging Technologies 2008 / 06 Vol. 31; Iss. 2

Reliability and Failure Analysis of Lead-Free Solder Joints for PBGA Package Under a Cyclic Bending Load

Ilho Kim,, Soon-Bok Lee,
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Volume:
31
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2008.921650
Date:
June, 2008
File:
PDF, 1.65 MB
english, 2008
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