[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Mechanical and board level reliability considerations of lidless flip chip BGA packaging
Low, Shin, Singh, Inderjit, Hariharan, Ganesh, Yip, Laurene, Zohni, Nael, Abtew, Mulugeta, Solaiappan, Gowri Shankar, Vair, Vineeth, Lewis, ShaneYear:
2013
Language:
english
DOI:
10.1109/ectc.2013.6575691
File:
PDF, 599 KB
english, 2013