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[IEEE 19th IEEE International Conference on Micro Electro Mechanical Systems - Istanbul, Turkey (22-26 Jan. 2006)] 19th IEEE International Conference on Micro Electro Mechanical Systems - Fabrication of the Flexible Sensor Using SOI Wafer by Removing the Thick Silicon Layer
Noda, K., Hoshino, K., Matsumoto, K., Shimoyama, I.Year:
2006
Language:
english
DOI:
10.1109/memsys.2006.1627751
File:
PDF, 808 KB
english, 2006