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[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - Problems with wirebonding on probe marks and possible solutions
Sauter, W., Aoki, T., Hisada, T., Miyai, H., Petrarea, K., Beaulied, F., Allard, S., Power, J., Agbesi, M.Year:
2003
Language:
english
DOI:
10.1109/ectc.2003.1216470
File:
PDF, 807 KB
english, 2003