Adhesive Force Characterization for MEM Logic Relays With...

Journal of Microelectromechanical Systems 2014 / 02 Vol. 23; Iss. 1

Adhesive Force Characterization for MEM Logic Relays With Sub-Micron Contacting Regions

Yaung, Jack, Hutin, Louis, Jeon, Jaeseok, Liu, Tsu-Jae King
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
23
Language:
english
Journal:
Journal of Microelectromechanical Systems
DOI:
10.1109/jmems.2013.2269995
Date:
February, 2014
File:
PDF, 524 KB
english, 2014
Conversion to is in progress
Conversion to is failed