Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures
1999 Vol. 17; Iss. 6
Experimental and analytical study of seed layer resistance for copper damascene electroplating
Broadbent, E. K., McInerney, E. J., Gochberg, L. A., Jackson, R. L.Volume:
17
Year:
1999
Language:
english
Journal:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
DOI:
10.1116/1.591132
File:
PDF, 511 KB
english, 1999