Experimental and analytical study of seed layer resistance...

Experimental and analytical study of seed layer resistance for copper damascene electroplating

Broadbent, E. K., McInerney, E. J., Gochberg, L. A., Jackson, R. L.
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Volume:
17
Year:
1999
Language:
english
Journal:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
DOI:
10.1116/1.591132
File:
PDF, 511 KB
english, 1999
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