[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Low-temperature, fine-pitch interconnections using self-patternable metallic nanoparticles as the bonding layer
Mehrotra, Gaurav, Jha, Gopal, Goud, Janagama D., Markondeya Raj, P., Venkatesan, Mali, Iyer, Mahadevan, Hess, Dennis, Tummala, RaoYear:
2008
Language:
english
DOI:
10.1109/ectc.2008.4550162
File:
PDF, 2.97 MB
english, 2008