Dependence of electromigration damage on Sn grain orientation in Sn–Ag–Cu solder joints
Chen, Jian-Qiang, Guo, Jing-Dong, Liu, Kai-Lang, Shang, Jian-KuVolume:
114
Year:
2013
Language:
english
Journal:
Journal of Applied Physics
DOI:
10.1063/1.4825323
File:
PDF, 1.41 MB
english, 2013