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[IEEE 2009 IEEE International Reliability Physics Symposium - Montreal, QC, Canada (2009.04.26-2009.04.30)] 2009 IEEE International Reliability Physics Symposium - Electromigration tests for critical stress and failure mechanism evaluation in Cu/W via/Al hybrid interconnect
Choi, Zungsun, Park, Byung-Lyul, Lee, Jong Myeong, Choi, Gil-Heyun, Lee, Hyeon-Deok, Moon, Joo-TaeYear:
2009
Language:
english
DOI:
10.1109/irps.2009.5173360
File:
PDF, 614 KB
english, 2009