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[IEEE 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) - Seattle, WA, USA (25-28 May 1998)] 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) - Tacky Dots/sup TM/ transfer of solder spheres for flip chip and electronic package applications
Hotchkiss, G., Amador, G., Jacobs, L., Stierman, R., Dunford, S., Hundt, P., Beikmohamadi, A., Cairncross, A., Gantzhorn, O., Quinn, B., Saltzberg, M.Year:
1998
Language:
english
DOI:
10.1109/ectc.1998.678730
File:
PDF, 1.17 MB
english, 1998