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Inductively coupled, point-of-use plasma abatement of perfluorinated compounds and hydrofluorinated compounds from etch processes utilizing O[sub 2] and H[sub 2]O as additive gases
Tonnis, Eric J., Graves, David B., Vartanian, Victor H., Beu, Laurie, Lii, Tom, Jewett, RustyVolume:
18
Year:
2000
Language:
english
Journal:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
DOI:
10.1116/1.582199
File:
PDF, 436 KB
english, 2000