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[IEEE 56th Electronic Components and Technology Conference 2006 - San Diego, CA (May 30 - June 2, 2006)] 56th Electronic Components and Technology Conference 2006 - Investigation of Residual Stress in Wafer-Level Interconnect Structures Induced by Wafer Processing
Guotao Wang,, Dongwen Gan,, Groothuis, S., Ho, P.S.Year:
2006
Language:
english
DOI:
10.1109/ectc.2006.1645669
File:
PDF, 503 KB
english, 2006