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[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Influence of reflow profile and Pb-free solder paste in minimizing voids for Quad Flat Pack No-lead (QFN) assembly
Gadepalli, Harish, Dhanasekaran, Rangaraj, Ramkumar, S. Manian, Jensen, Tim, Briggs, EdYear:
2009
Language:
english
DOI:
10.1109/ectc.2009.5074299
File:
PDF, 845 KB
english, 2009