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[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Dissolution of substrates in line-type Cu/Sn/Cu and Cu/Sn/Ni interconnects under current stressing
Pan, Song, Huang, Mingliang, Zhao, Ning, Zhou, Shaoming, Zhang, ZhijieYear:
2012
Language:
english
DOI:
10.1109/icept-hdp.2012.6474867
File:
PDF, 1.54 MB
english, 2012