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[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Challenges in Temperature Cycling Test for Electronic Packages Containing Low-K/Cu Silicon
Lee, Chu-Chung, Tran, Tu Anh, Yuan, Yuan, Siong, Chin-Teck, Lau, TBYear:
2007
Language:
english
DOI:
10.1109/ectc.2007.373944
File:
PDF, 4.40 MB
english, 2007