[IEEE 2007 Proceedings 57th Electronic Components and...

  • Main
  • [IEEE 2007 Proceedings 57th Electronic...

[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Challenges in Temperature Cycling Test for Electronic Packages Containing Low-K/Cu Silicon

Lee, Chu-Chung, Tran, Tu Anh, Yuan, Yuan, Siong, Chin-Teck, Lau, TB
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2007
Language:
english
DOI:
10.1109/ectc.2007.373944
File:
PDF, 4.40 MB
english, 2007
Conversion to is in progress
Conversion to is failed