[IEEE 2010 IEEE International Electron Devices Meeting (IEDM) - San Francisco, CA, USA (2010.12.6-2010.12.8)] 2010 International Electron Devices Meeting - Advanced flip-chip package production solution for 40nm/28nm technology nodes
Chen, C. S., Liu, C. S., Lee, C. H., Tsai, H.Y., Pu, H.P., Hsu, K.C., Kuo, H.J., Cheng, M.D., Wu, C.Y., Chiu, S.L., Wu, K.C., Chen, H.W., Hsiao, C.W., Tung, C. H., Lii, M. J., Yu, Douglas C.H.Year:
2010
Language:
english
DOI:
10.1109/iedm.2010.5703472
File:
PDF, 2.13 MB
english, 2010