![](/img/cover-not-exists.png)
[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Dynamic characteristics analysis of the flip chip bonding head based on multiple working conditions
Gong, Wenfeng, Huang, Meifa, Chen, Leilei, Tang, Liang, Ye, LezhiYear:
2013
Language:
english
DOI:
10.1109/icept.2013.6756570
File:
PDF, 1.08 MB
english, 2013