![](/img/cover-not-exists.png)
[IEEE 2006 8th International Conference on Solid-State and Integrated Circuit Technology Proceedings - Shanghai, China (2006.10.23-2006.10.26)] 2006 8th International Conference on Solid-State and Integrated Circuit Technology Proceedings - An investigation on the bonding surface energy versus time in low temperature wafer bonding
Zhang, Xuan, Olbrechts, Benoit, Raskin, Jean-pierreYear:
2006
Language:
english
DOI:
10.1109/icsict.2006.306308
File:
PDF, 74 KB
english, 2006