RF flip-module BGA package
Low, Y.L., Degani, Y., Guinn, K.V., Dudderrar, T.D., Gregus, J.A., Frye, R.C.Volume:
22
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/6040.763180
Date:
May, 1999
File:
PDF, 282 KB
english, 1999