Chemistry of Cu deposition by Cu(hfac)(tmvs) monitored by Li[sup +] ion attachment mass spectrometry
Fujii, Toshihiro, Arulmozhiraja, Sundaram, Nakamura, Megumi, Shiokawa, YoshiroVolume:
100
Year:
2006
Language:
english
Journal:
Journal of Applied Physics
DOI:
10.1063/1.2360768
File:
PDF, 308 KB
english, 2006