Nondestructive analysis of ultrashallow junctions using...

Review of Scientific Instruments 2003 Vol. 74; Iss. 1

Nondestructive analysis of ultrashallow junctions using thermal wave technology

Nicolaides, Lena, Salnick, Alex, Opsal, Jon
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Volume:
74
Year:
2003
Language:
english
Journal:
Review of Scientific Instruments
DOI:
10.1063/1.1515890
File:
PDF, 282 KB
english, 2003
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