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[IEEE 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2013.10.22-2013.10.25)] 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - WiFi SiP module using IPD Rx Balun applications
Chuang, Min-Han, Lai, Chia-Chu, Lin, Ho-Chuan, Tsai, Ming-Fan, Chen, Camus, Yang, Erico, Lee, DanielYear:
2013
Language:
english
DOI:
10.1109/impact.2013.6706641
File:
PDF, 1.25 MB
english, 2013