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[IEEE 2007 IEEE Conference on Electron Devices and Solid-State Circuits - Tainan, Taiwan (2007.12.20-2007.12.22)] 2007 IEEE Conference on Electron Devices and Solid-State Circuits - Advanced Enhanced High Heat Dissipation Package Structures
Weng, Chun-JenYear:
2007
Language:
english
DOI:
10.1109/edssc.2007.4450308
File:
PDF, 2.72 MB
english, 2007