Development of CSP Using Au Ball Bumps as External Connection Terminals
Onodera, M., Nakajo, S., Ikumo, M., Kawahara, T.Volume:
27
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2004.824935
Date:
February, 2004
File:
PDF, 355 KB
english, 2004