Flip chip die attach development for multichip mechatronics...

IEEE Transactions on Electronics Packaging Manufacturing 2001 / 10 Vol. 24; Iss. 4

Flip chip die attach development for multichip mechatronics power packages

Paulasto-Krockel, M., Hauck, T.
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Volume:
24
Language:
english
Journal:
IEEE Transactions on Electronics Packaging Manufacturing
DOI:
10.1109/6104.980039
Date:
October, 2001
File:
PDF, 270 KB
english, 2001
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