The copper–silicon interface: Composition and...

The copper–silicon interface: Composition and interdiffusion

Corn, Stewart H.
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Volume:
6
Language:
english
Journal:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
DOI:
10.1116/1.575620
Date:
May, 1988
File:
PDF, 656 KB
english, 1988
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