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[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Design and fabrication of a test chip for 3D integration process evaluation
Song, Chongshen, Wang, Zheyao, Liu, LitianYear:
2011
Language:
english
DOI:
10.1109/ectc.2011.5898751
File:
PDF, 2.16 MB
english, 2011