[IEEE 7th. Int. Conf. on Thermal, Mechanical and...

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[IEEE 7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems - Como, Italy (24-26 April 2006)] 7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems - Design, Experiment and Analysis of the Solder on Rubber (SOR) structure of WLCSP

Yuan, C., Zhang, G.Q., Ching-Shun Huang,, Chun-Hui Yu,, Chin-Cheng Yang,, Wen-Kung Yang,, Ming-Chih Yew,, Cheng Nan Han,, Kou-Ning Chiang,
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Year:
2006
Language:
english
DOI:
10.1109/esime.2006.1643969
File:
PDF, 4.68 MB
english, 2006
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