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[IEEE 40th Conference on Electronic Components and Technology - Las Vegas, NV, USA (20-23 May 1990)] 40th Conference Proceedings on Electronic Components and Technology - Development of ultra-thin surface mounting IC package (0.8 mm thick TQFP)
Fujita, K., Oomi, S., Toyozawa, K., Minamide, S., Maeda, T.Year:
1990
Language:
english
DOI:
10.1109/ectc.1990.122206
File:
PDF, 509 KB
english, 1990