[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Novel solder-on-pad (SoP) technology for fine-pitch flip chip bonding
Choi, Kwang-Seong, Sun-Woo Choo,, Jong-Jin Lee,, Ki-Jun Sung,, Hyun-Chel Bae,, Byeong-Ok Lim,, Jong-Tae Moon,, Eom, Yong-SungYear:
2010
Language:
english
DOI:
10.1109/icept.2010.5582689
File:
PDF, 796 KB
english, 2010