Chemothermal modeling and finite-element analysis for...

IEEE Transactions on Electronics Packaging Manufacturing 2005 / 10 Vol. 28; Iss. 4

Chemothermal modeling and finite-element analysis for microwave cure process of underfill in flip-chip packaging

Lie Liu,, Sung Yi,, Lin Seng Ong,, Chian, K.S., Osiyemi, S., Sin Heng Lim,, Fei Su,
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
28
Language:
english
Journal:
IEEE Transactions on Electronics Packaging Manufacturing
DOI:
10.1109/tepm.2005.857676
Date:
October, 2005
File:
PDF, 659 KB
english, 2005
Conversion to is in progress
Conversion to is failed