[IEEE 6th Electronics Packaging Technology Conference (EPTC 2004) - Singapore (8-10 Dec. 2004)] Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) - Pb-free plating: a process and solder joint reliability study
Ming Sing Ong,, Yi Ming Lau,, Ah Chin Tan,Year:
2004
Language:
english
DOI:
10.1109/eptc.2004.1396596
File:
PDF, 519 KB
english, 2004