[IEEE 2007 8th International Conference on Electronic...

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[IEEE 2007 8th International Conference on Electronic Packaging Technology - Shanghai, China (2007.08.14-2007.08.17)] 2007 8th International Conference on Electronic Packaging Technology - Backside IR Photon Emission Microscopy (IR-PEM) Observation in Failure Analysis of the Packaged Devices

Tao, Jianlei, Fang, Peiyuan, Wang, Jiaji
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Year:
2007
Language:
english
DOI:
10.1109/icept.2007.4441539
File:
PDF, 1.48 MB
english, 2007
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