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[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - The over-bump applied resin wafer-level underfill process: Process, material and reliability
Feger, Claudius, LaBianca, Nancy, Gaynes, Michael, Steen, Steven, Liu, Zhen, Peddi, Raj, Francis, MarkYear:
2009
Language:
english
DOI:
10.1109/ectc.2009.5074211
File:
PDF, 657 KB
english, 2009