Dynamic-stress-induced dielectric breakdown in ultrathin...

IEEE Electron Device Letters 1992 / 04 Vol. 13; Iss. 4

Dynamic-stress-induced dielectric breakdown in ultrathin nitride/oxide stacked films deposited on rugged polysilicon

Lo, G.Q., Kwong, D.-L., Mathews, V.K., Fazan, P.C., Ditali, A.
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Volume:
13
Language:
english
Journal:
IEEE Electron Device Letters
DOI:
10.1109/55.145014
Date:
April, 1992
File:
PDF, 293 KB
english, 1992
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