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[IEEE 2014 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) - Yokohama, Japan (2014.9.9-2014.9.11)] 2014 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) - USJ engineering impacts on FinFETs and RDF investigation using full 3D process/device simulation
Bazizi, E. M, Zaka, A., Herrmann, T., Benistant, F., Tin, J. H. M., Goh, J. P., Jiang, L., Joshi, M., van Meer, H., Korablev, K.Year:
2014
Language:
english
DOI:
10.1109/sispad.2014.6931554
File:
PDF, 1.11 MB
english, 2014