[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - High quality & low thermal resistance eutectic flip chip LED bonding
Lam, Ngai-Sze, Lee, Chi-Yung, Wan, Ming-Yeung, Tian, Dewen, Li, MingYear:
2013
Language:
english
DOI:
10.1109/icept.2013.6756673
File:
PDF, 1.57 MB
english, 2013