Synthesis of polyimides containing triazole to improve...

Journal of Adhesion Science and Technology 2002 / 01 Vol. 16; Iss. 13

Synthesis of polyimides containing triazole to improve their adhesion to copper substrate

Seo, Jeonghoon, Kang, Jeonghoon, Cho, Kilwon, Park, Chan Eon
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Volume:
16
Language:
english
Journal:
Journal of Adhesion Science and Technology
DOI:
10.1163/156856102320396175
Date:
January, 2002
File:
PDF, 251 KB
english, 2002
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