Simulation and Experiments of Stress Migration for Cu/low-k...

IEEE Transactions on Device and Materials Reliability 2004 / 09 Vol. 4; Iss. 3

Simulation and Experiments of Stress Migration for Cu/low-k BEoL

Zhai, C.J., Yao, H.W., Marathe, A.P., Besser, P.R., BlishII, R.C.
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Volume:
4
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2004.833225
Date:
September, 2004
File:
PDF, 733 KB
english, 2004
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