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[IEEE 2012 IEEE Symposium on VLSI Technology - Honolulu, HI, USA (2012.06.12-2012.06.14)] 2012 Symposium on VLSI Technology (VLSIT) - Demonstration of inter-chip data transmission in a three-dimensional stacked chip fabricated by chip-level TSV integration
Hozawa, Kazuyuki, Furuta, Futoshi, Hanaoka, Yuko, Aoki, Mayu, Osada, Kenichi, Takeda, Kenichi, Lee, Kang Wook, Fukushima, Takafumi, Koyanagi, MitsumasaYear:
2012
Language:
english
DOI:
10.1109/vlsit.2012.6242518
File:
PDF, 379 KB
english, 2012