Wafer Level Packaging of Micromachined Gas Sensors

IEEE Sensors Journal 2006 / 10 Vol. 6; Iss. 5

Wafer Level Packaging of Micromachined Gas Sensors

Raible, S., Briand, D., Kappler, J., De Rooij, N.F.
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Volume:
6
Language:
english
Journal:
IEEE Sensors Journal
DOI:
10.1109/jsen.2006.881355
Date:
October, 2006
File:
PDF, 491 KB
english, 2006
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