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[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - A numerical analysis of crack growth and morphology evolution in chip-to-packages nano-interconnections
Sau Koh,, Rao Tummala,, Saxena, Ashok, Selvam, P.Year:
2008
Language:
english
DOI:
10.1109/ectc.2008.4550194
File:
PDF, 497 KB
english, 2008