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[IEEE 2014 International Conference on Electronics Packaging (ICEP) - Toyama, Japan (2014.4.23-2014.4.25)] 2014 International Conference on Electronics Packaging (ICEP) - Reliability characterization of 2.5D multi-chip module on board under drop impact
Tzu-Hsuan Cheng,, Cheng, Hsien-Chie, Chen, Wen-Hwa, Hsin-Yi Huang,, Tao-Chih Chang,Year:
2014
Language:
english
DOI:
10.1109/icep.2014.6826691
File:
PDF, 1.29 MB
english, 2014