[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Finite element based three dimensional crack propagation simulation on interfaces in electronic packages
Ozkan, Umit, Nied, Herman F.Year:
2008
Language:
english
DOI:
10.1109/ectc.2008.4550191
File:
PDF, 764 KB
english, 2008