Effect of cooling rate on interfacial fatigue-crack growth...

IEEE Transactions on Components Packaging and Manufacturing Technology Part B 1996 / Feb. Vol. 19; Iss. 1

Effect of cooling rate on interfacial fatigue-crack growth in Sn-Pb solder joints

Daping Yao,, Jian Ku Shang,
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Volume:
19
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
DOI:
10.1109/96.486498
Date:
January, 1996
File:
PDF, 3.73 MB
english, 1996
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