[IEEE 2011 IEEE 13th Electronics Packaging Technology...

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[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Heat Affected Zone and inter-metallic's formation in gold wire thermosonic bonding as function of wire material

Premkumar, Jeromerajan, Gopinath, Maasi, Meng Yong Shie,, Gary-TS Tay,
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Year:
2011
Language:
english
DOI:
10.1109/eptc.2011.6184539
File:
PDF, 2.67 MB
english, 2011
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