IEEE Transactions on Components Packaging and Manufacturing Technology Part B
1994 / Aug. Vol. 17; Iss. 3
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The importance of material selection for flip chip on board assemblies
O'Malley, G., Giesler, J., Machuga, S.Volume:
17
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
DOI:
10.1109/96.311770
Date:
January, 1994
File:
PDF, 868 KB
english, 1994