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[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - The study of interficial reaction during rapidly solidified lead-free solder Sn3.5Ag0.7Cu/Cu laser soldering
Liu, Jiahui, Ma, Haitao, Li, Shuang, Sun, Junhao, Kunwar, Anil, Miao, Wang, Hao, Jianjie, Bao, YanpengYear:
2014
Language:
english
DOI:
10.1109/icept.2014.6922804
File:
PDF, 1.15 MB
english, 2014